脉冲偏压对电弧离子镀Ti/TiN纳米多层薄膜显微硬度的影响
注意：本论文已在《金属学报》，2005，41（10）：1106-1110发表
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赵彦辉1），林国强1, 2），李晓娜1, 2），董闯1），闻立时1, 3）
1） 大连理工大学三束材料改性国家重点实验室，大连，116024
2） 大连理工大学物理系，大连，116024
3） 中国科学院金属研究所，沈阳，110016
摘 要 用脉冲偏压电弧离子镀方法在高速钢基体上沉积Ti/TiN纳米多层薄膜，用正交实验法设计脉冲偏压电参数，考察脉冲偏压对Ti/TiN纳米多层薄膜显微硬度的影响。结果表明，在所有偏压参数（脉冲偏压幅值、占空比和频率）和几何参数（调制周期和周期比）中，脉冲偏压幅值是影响显微硬度的最主要因素；当沉积工艺中脉冲偏压幅值为900V、占空比为50%及频率为30
kHz时，薄膜硬度可高达34.1GPa，此时多层膜调制周期为84nm，TiN、Ti单元层厚度分别为71nm和13nm；由于薄膜中的单层厚度较厚，纳米尺寸的强化效应并未充分体现于薄膜硬度的贡献中，硬度的提高主要与脉冲偏压工艺，尤其是脉冲偏压幅值对薄膜组织的改善有关。
关键词：脉冲偏压，电弧离子镀，Ti/TiN纳米多层薄膜，显微硬度
EFFECT OF PULSED BIAS ON MICROHARDNESS OF TI/TIN MULTILAYER FILMS DEPOSITED
BY ARC ION PLATING
ZHAO Yanhui 1), LIN Guoqiang 1, 2) , LI Xiaona 1, 2)
, DONG Chuang 1) ,WEN Lishi 1, 3)
1) State Key Laboratory for Materials Modification by Laser, Ion and Electron
Beams, Dalian University of Technology, Dalian 116024
2) Physics Department, Dalian University of Technology, Dalian 116024
3) Institute of Metals Research, The Chinese Academy of Sciences, Shenyang
110016
Correspondent: LIN Guoqiang, professor, Tel: (0411)84708380-8301, Email:
gqlin@dlut.edu.cn
Supported by National High Technical Research and Development of Programme
of China (2002AA302507)
ABSTRACT Ti/TiN nano-multilayer films were
deposited on high-speed-steel (HSS) substrates using arc ion plating,
in which orthogonal experiments were used to analyze the effects of the
electrical parameters of pulsed bias on microhardness of Ti/TiN multilayer
films. The results show that of all the pulsed bias related parameters
including pulsed bias magnitude, duty ratio and frequency and the geometry
parameters including modulation period and period ratio, pulsed bias magnitude
is the major factor affecting microhardness of the multilayer films. The
maximum microhardness of 34.1GPa was obtained with pulsed bias magnitude
900V, duty ratio 50% and frequency 30kHz, and the responding modulation
period is 84nm, the unit set layer thickness of TiN and Ti are 71nm and
13nm, respectively. Due to the large unit set layer thickness used in
the present experiments, the nano-scale strengthening effect is not obviously
manifested. The increasing of the microhardness correlates in a significant
manner with refining film microstructure resulted from the pulsed bias
parameters especially the pulsed bias magnitude.
KEYWORDS pulsed bias, arc ion plating, Ti/TiN nano-multilayer
films, microhardness
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